Qualcomm Snapdragon 860 (SM8150-AC) 规格技术
Qualcomm Snapdragon 860 (SM8150-AC)规格，基准，性能，架构，内存和所有芯片组规格和技术特点。
⚙️ 处理器规格 | |
| Qualcomm Snapdragon 860 (SM8150-AC) | |
| 制造商 | Qualcomm |
| 芯片组 | Snapdragon 860 (SM8150-AC) |
| 其他名称/代号 | SM8150-AC, Snapdragon 860 |
| 发布日期 | 2019/7/4 |
| 最大时钟支持 | 2.96GHz |
| 总的处理器核心 | 8 |
| CPU | 八核, 3个处理器: 1x 2.96GHz Kryo 485 Gold (单核) 3x 2.42GHz Kryo 485 Gold (三核) 4x 1.78GHz Kryo 485 Silver (四核) |
| GPU（图形处理器） | Qualcomm Adreno 640 (250-672MHz) |
| 晶体管尺寸（纳米） | 7 nm |
| 架构 | 64bit, ARMv8-A (A32, A64) |
| Level 1 Cache | 64KB |
| Level 2 Cache | 1.78MB |
| Level 3 Cache | 2MB |
| RAM内存类型 | LPDDR4X |
➕ 其他特点 | |
| Qualcomm Snapdragon 860 (SM8150-AC) | |
| • Qualcomm Snapdragon X50 Modem-RF System (5G version) • Qualcomm QTM052 5G mmWave (mmWave version) • Qualcomm Snapdragon X24 LTE modem (4G version) • Qualcomm Hexagon 690 Processor • Qualcomm FastConnect 6200 • Qualcomm Spectra 380 ISP • Qualcomm Hexagon Tensor Accelerator • 4G/5G Download: 2 Gbps / Upload: 316 Mbps • LPDDR4X 4x16bit (2133MHz) | |
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